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Hot melting adhesive tape and applied to tapingelectronic components
specification :
Test Item |
Test Method |
Tech Data |
Thickness)(mm) |
GB/T7125-1999 |
0.18±0.01 |
Tensile Strength)(N/in) |
GB7753-1987 |
70↑ |
Elongation)(%) |
GB7753-1987 |
10↑ |
Dynamic Shear Testing)(N/in) |
QC-QWI-035 |
40↑ |
Width)(mm) |
Slide Caliper |
±0.2 |
Length)(m) |
Electronic Counter |
±1% |
Application
Applied to taping of electronic components.
Features
Low initial tack, excellent adhesion under high temperature, used in combination with kraft paper. It has good holding power & solvent resistance.